Quote:
Originally posted by N8
The problem with doing such a TIM layer (as I have stated in the past), is that both surfaces (CPU and heatsink), MUST both have a matched flatness tolerance with each other less than the TIM layer thickness. You want a thin TIM layer, correct? Well you first have to have the CPU and heatsink prepared. The P4 IHS is NOT flat at all, forget about the P4 at this time. The AMD core is going to be pretty damn flat, and I wouldn't worry about lapping it.
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Just how flat is the amd core are we talking a few microns or <1 micron
and if the amd core is flat enough if we were to get the base of the heatsink or waterblock to a similar flatness we could do without the paste.