Quote:
Originally posted by hara
Why don't you try this shin etsu stuff.
Another TIM idea I had was to use gold leaf between the CPU and cooler.
The reasons are simple: Gold is a very mallable material and with compression *could* make a good TIM. The leaf is only a few microns thick.
Gold's thermal conductivity isn't bad at all. It is better than aluminium but not quite as good as copper. If you calculate the thermal resistance for that short distance, the difference between it and silver would be negligable IMO.
I saw a thread on [H] once about using al foil. Some people got quite good results since the foil is adaptive. That is why I'm suggesting gold leaf now.
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I might try the Shin Etsu, if I can find specs for it.
Maybe this thread should be turned back into listing various products, and specs?!?
You go ahead and try gold or Alu. I think I'll stick to tested and proven products, for now.