As stated there is no way to determine at present how much heat is distributed away from the original core area with that spreader and the new core size and voltages. Knowing this it is a fallacy imho at present to say, who is going to determine what testbed to use and THEN dermine which setup is best.
Now, we could wait for the chip to be tested by someone of repute, or we could just start to adjust our focus to a slightly larger core footprint, which in likely hood will happen soon if not in this chip. A heat spreader will ultimately do just that if they are used in future chips. How could it not?
Of course you can say, we don't have a test to determine that we need to focus our minds on a larger core heat area. But in the same logic I don't feel that anyone can assume with the same logic that we can just keep what measurements and focus that we have now on the smaller one.
Cathar: if you were referring to the WW, I do not understand how this is accounting for a larger heat area. If you feel it does, please explain. If you were referring to micro cup design I think feel that that design would be better suited to this "trend?". Your ideas and explinations are as always valued. Thanks
*Back to topic*
What are some good ways to port our existing designs that work to a larger area?
__________________
-winewood-
Last edited by winewood; 06-29-2003 at 07:37 AM.
|