Quote:
Originally posted by N8
5 mm? Holy crap that is pretty thick. I am guessing you mean 5 micro meters (microns)? You could do that (5 microns) with a sputter deposition setup, but I don't have one with easy access.
The other problem that could occur once you start growing/depositing/layering metallic layers is that they could de-bond or flake off and some point in the installation or removal and then you have a problem with a very conductive particle(s) on your CPU/mobo.
|
I think he wants to know about creating the water block directly on the die. Virtually eliminating the TIM.
How thick of a deposit would you need to create a Cascade type block? How would you seal it? Is there a way to create a form to grow the base inside of (ideally we would not want to machine this)?