Pro/Forums - View Single Post

redleader · 07-03-2003, 05:44 PM

Ben:

As long as you're back there, heres a better idea. Reinforce the back of the die and then increase the clamping pressure. Higher pressure means a better interface between the CPU/TIM/Block. Cut into that 8C gap mentioned in your other thread.

07-03-2003, 05:44 PM	#52
redleader Thermophile Join Date: Jun 2001 Location: The deserts of Tucson, Az Posts: 1,264	Ben: As long as you're back there, heres a better idea. Reinforce the back of the die and then increase the clamping pressure. Higher pressure means a better interface between the CPU/TIM/Block. Cut into that 8C gap mentioned in your other thread.