Quote:
Originally posted by jaydee116
So your going to try and solder an Aluminum die from the CPU to a Copper water block?
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I didn't see aluminum mentioned.
I believe the idea is to plate silver onto the silicon of the die, and then solder the die to the block.
I have some reservations about the idea, but it's interesting.
It would be a good idea to look into the differences in the temperature coefficient of expansion of copper, silicon, and indium/tin solder. It may be that the die would be cracked by the contraction of the waterblock as the soldered die/block cools down from soldering temperature.