Now that I've read various comments, I agree that you probably have to put heatsinks on the warmer parts anyways, or equivalently complex manifolds for direct impingement.
That negates the benefits of the whole idea. Might as well just put good waterblocks on the hot logic parts and good heatsinks on the warm parts or things like the mosfets which perform pretty good hot, anyways.
Thanks for all the inputs, everyone. I, for one, am satisfied to look elsewhere for easier gains.
Now, on to the backside cooling waterblock!
Larry Lewis
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