Quote:
Originally posted by #Rotor
the only time that much pressure is required.... is when you have that pink goo (that comes on std HSF's) between your block and the CPU. the core is hard as glass, the copper... well not quite as hard, but hard enough not to deform, under any reasonable pressure, 2 non budging flat hard surfaces getting squeezed together, I know it will not make the slightest difference whether you had 3Lb or 30Lb on that block. the TIM has been formed the moment all the access thermal paste has been squeezed out, and that's it, nothing more to gain by more pressure...other than maybe a crack or two...
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Suggest you spend a little time on Google looking for the effects of pressure on thermal interface junction efficiency.
There is a wealth of well conducted research that supports the opposite to what you are saying, and supports what Jaydee and myself have witnessed.