Pro/Forums - View Single Post - Increasing pressure on waterblock to lower temps

#Rotor · 07-13-2003, 08:17 AM

disagreement is good

but now, could it not be concluded, that by running the liquid side of this thermal interface in a high pressure state... I.E pressurizing the water-loop. It would have the effect of squeezing the water molecules closer to the copper, right? water does not compress much, or at all... so would it work on the water side????

I'm looking at this on the molecular level. you can only get the two surfaces to touch that much, if nothing is bending, and nothing is deforming, then you will gain no more conduction than what you had at the point of optimal touch. I do not mean that you only need a feather, for down-force.... heat transfer is not dependant on pressure, it is a factor of surface and Delta T and material character.

the reason pressure seems to have an advantageous effect on heat transfer, comes from that goo they put on the heatsinks. it needs to get squeezed out, from between the core and the sink, now obviously the more "gooey" the goo, the more pressure you would need to get rid of it. Proper thermal paste, (white, stuff) is a paste, it is not elastic and not gooey, thus it will squeeze into perfect conformity and it will allow for crests in the two surfaces to actually make contact, for this you do not need 30Lb on the block with a minute little core.

A tec appears to need so much more, because of its surface area, being so much larger, pressure is given as down-force per surface area integer, correct? thus, to acquire the same amount of pressure, over a larger area, you would need more down-force, if I remember correctly ( been a long time )

as for googling on it, I prefer to reason it out with people that actually know what they are talking about...

Google is a last minute, emergancy solution to a problem that is bigger and stronger than me.

07-13-2003, 08:17 AM	#14
#Rotor Cooling Savant Join Date: Feb 2002 Location: Dione, sector 4s1256 Posts: 852	disagreement is good but now, could it not be concluded, that by running the liquid side of this thermal interface in a high pressure state... I.E pressurizing the water-loop. It would have the effect of squeezing the water molecules closer to the copper, right? water does not compress much, or at all... so would it work on the water side???? I'm looking at this on the molecular level. you can only get the two surfaces to touch that much, if nothing is bending, and nothing is deforming, then you will gain no more conduction than what you had at the point of optimal touch. I do not mean that you only need a feather, for down-force.... heat transfer is not dependant on pressure, it is a factor of surface and Delta T and material character. the reason pressure seems to have an advantageous effect on heat transfer, comes from that goo they put on the heatsinks. it needs to get squeezed out, from between the core and the sink, now obviously the more "gooey" the goo, the more pressure you would need to get rid of it. Proper thermal paste, (white, stuff) is a paste, it is not elastic and not gooey, thus it will squeeze into perfect conformity and it will allow for crests in the two surfaces to actually make contact, for this you do not need 30Lb on the block with a minute little core. A tec appears to need so much more, because of its surface area, being so much larger, pressure is given as down-force per surface area integer, correct? thus, to acquire the same amount of pressure, over a larger area, you would need more down-force, if I remember correctly ( been a long time ) as for googling on it, I prefer to reason it out with people that actually know what they are talking about... Google is a last minute, emergancy solution to a problem that is bigger and stronger than me. __________________ There is no Spoon.... Last edited by #Rotor; 07-13-2003 at 08:32 AM.