Well, if you remember that a contact without any paste results in an actual contact area around 5%, then it's not so hard to see that adding pressure will result in more direct copper-to-die contact.
Cathar ran the numbers for his Cascade block, and the TIM joint, for an 80W source leave an 8 degree Celsius spread, between the block and die, through the TIM joint.. So anything you can really do to minimize that, surely helps.
edit: of course if the CPU is idle, that temp difference would be proportionally lower.
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