Quote:
Originally posted by #Rotor
...BUT more pressure does not result in better conductivity...
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You're right, it doesn't improve conductivity. What it does is reduce the temperature gradient, between the heat source (inside the die) and the ambient air. By reducing the gradient, it's possible to reduce the die temp.
Personally, I'd rather stick to AMD specs. If I had Bill's surface gauging tool, and I knew the deflection that I can expect from my block, and if the surface geometry could be bend to be flat with a reasonable amount of pressure, then I'd give it a shot. IMO, clamping the block near 100 lbs, puts the core in a position where if you even bump into the PC, it could crush the core.