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N8 · 08-05-2003, 01:24 PM

LN is so cold that you will be freezing and condensing water vapor from the air to your motherboard and motherboard components (capacitors, resistors, etc.) all around your socket for up to several inches radius. I do not know how you would effectively insulate the mobo and these components.

I am sitting here right now with only about 4 ounces of LN inside of a stryofoam cup which is stacked inside a second identical sytrofoam cup and ice is forming on the outside of the second cup.

When you apply LN to a solid (for example, metals), the metal will cool enough to shrink in size and dimensions slightly. This is how many parts are press fit together. You need to take this into consideration when making a copper containment device to sit on your cpu. Your mobo will most certainly have to be laying flat so that the weight of the copper container will not stress the mobo. I would NOT attach it to the socket mounts as they will become cold enough to be brittle and the tension of the dimension changes could break things apart.

You would want to attach it directly to the mobo holes and pour in the LN very gradually so the thermal shock will be minimized. One of the reasons people use very large, very thick walled copper containers is to minimize the thermal shock and dimensional changes when the LN is added. I do not think that a heatsink with walls welded to it would work well. The welds may just break or come loose due to the dimensional changes (a possibility). I would test it with LN before actually using it on the processor/mobo to see what happens.

I have access to hundreds of gallons of LN and have been a crazy overclocker for over 5 years and I haven't felt like bothering with all the hassles of LN cooling yet. It is just not worth the effort and troubles. Good luck with your testing.

08-05-2003, 01:24 PM	#6
N8 Cooling Neophyte Join Date: Sep 2002 Location: Pullman, WA Posts: 91	LN is so cold that you will be freezing and condensing water vapor from the air to your motherboard and motherboard components (capacitors, resistors, etc.) all around your socket for up to several inches radius. I do not know how you would effectively insulate the mobo and these components. I am sitting here right now with only about 4 ounces of LN inside of a stryofoam cup which is stacked inside a second identical sytrofoam cup and ice is forming on the outside of the second cup. When you apply LN to a solid (for example, metals), the metal will cool enough to shrink in size and dimensions slightly. This is how many parts are press fit together. You need to take this into consideration when making a copper containment device to sit on your cpu. Your mobo will most certainly have to be laying flat so that the weight of the copper container will not stress the mobo. I would NOT attach it to the socket mounts as they will become cold enough to be brittle and the tension of the dimension changes could break things apart. You would want to attach it directly to the mobo holes and pour in the LN very gradually so the thermal shock will be minimized. One of the reasons people use very large, very thick walled copper containers is to minimize the thermal shock and dimensional changes when the LN is added. I do not think that a heatsink with walls welded to it would work well. The welds may just break or come loose due to the dimensional changes (a possibility). I would test it with LN before actually using it on the processor/mobo to see what happens. I have access to hundreds of gallons of LN and have been a crazy overclocker for over 5 years and I haven't felt like bothering with all the hassles of LN cooling yet. It is just not worth the effort and troubles. Good luck with your testing.