Quote:
Originally posted by Cathar
Actually not my testing but by way of BillA. Bill had forwarded me a very interesting graph once that plotted the thermal junction difference betwen various points using thermal sensors placed at different levels between the heat source and the water coolant.
Roughly speaking it was showing around a 0.08 to 0.10 C/W for the thermal interface junction (when using goop) for a 100mm^2 heat die.
|
Originates from an inconclusive discussion:
http://forums.overclockers.com.au/sh...threadid=67401
The Off-forum,rather inadequate analysis of the data should be treated very cautiously.
To assume the same TIM Joint resistance for different wbs is dangerous and can lead to possibly erroneous conclusions.For example would suspect that the fly-cut(?) surface of "The Cascade" produces a lower TIM joint resistance than the hand-lapped " White-Water".Think it is inconclusive that the reduction in temperatures for "The Cascade" is due to lower Convective Resistance and not due to a lower TIM Joint resistance.