Quote:
[i
I still believe Bill's value of ~0.08-0.10C/W for the thermal interface layer. Yes, Bill's thermal probe was about 1mm below the surface, but the heat flows through the copper in a fairly linear gradient when talking about distances this small, and the graph I saw was plotting the gradients either side of the measurement points and extrapolating from there. There were some small anomalies, hence the "uncertainty", but to date it is the best evidence I've seen to quantify the size of the thermal barrier, unless someone has some better real testing to show. [/b]
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To my knowledge Bill Adam's never gave a value of 0.08- 01c/w for the thermal resistance of a TIM joint
It was agreed privately as a "possible value" until we knew more.
Then was used .
FI Probe 2mm below surface (check orig
http://forums.overclockers.com.au/sh...threadid=67401