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TerraMex · 08-28-2003, 01:40 AM

> For laptops you could probably use the back of the display as a
> large passive heatsink.

Makes sense.

Just as reference, if you check the Hitachi link i posted, they used , for the prototype , the lower metal plate for heat dissipation. Stainless steel. Probably because corrosion issues.

But then again, taking BigBen's idea, couldnt you also use the backplate connected to a series of heatpipes attached to a heatsink on the processor? Something similar to what Zalman is doing in the "all heatpipe case" .

And does anybody remember this ? If i recall correctly, it has a series of microchannels inside.

Edit: just found this

http://www-me.stanford.edu/globals/goodson2.html

Crap pictures thou. I guess Cathar hit the spot again

.

PS:
http://ssd-rd.web.cern.ch/ssd-rd/sem...eniers-pt2.pdf
http://cjmems.seas.ucla.edu/papers/Joo_MEMS95.PDF

08-28-2003, 01:40 AM	#33
TerraMex Cooling Savant Join Date: Nov 2002 Location: Portugal, Europe Posts: 870	> For laptops you could probably use the back of the display as a > large passive heatsink. Makes sense. Just as reference, if you check the Hitachi link i posted, they used , for the prototype , the lower metal plate for heat dissipation. Stainless steel. Probably because corrosion issues. But then again, taking BigBen's idea, couldnt you also use the backplate connected to a series of heatpipes attached to a heatsink on the processor? Something similar to what Zalman is doing in the "all heatpipe case" . And does anybody remember this ? If i recall correctly, it has a series of microchannels inside. Edit: just found this http://www-me.stanford.edu/globals/goodson2.html Crap pictures thou. I guess Cathar hit the spot again . PS: http://ssd-rd.web.cern.ch/ssd-rd/sem...eniers-pt2.pdf http://cjmems.seas.ucla.edu/papers/Joo_MEMS95.PDF __________________ "we need more cowbell."