Quote:
Originally posted by FL3JM
Direct Die Cooling will probably be alot more usefull with the new Athlon64 processors, they have heatspreader all over the top of the whole thing, like the P4 but even bigger.
The core is alot bigger too so that will prolly aid in direct die cooling.
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Pics of the nude Athlon64 for you strange people who havnt seen it allready:
http://www.tbreak.com/forums/showthr...5&pagenumber=1
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Heat spreader is rally irrelevant, if you want to direct die cool it has to go. BUT, direct IHS cooling has some possibilities. We discussed it before for the Intel. The AMD IHS looks bigger and I do not see any holes in it like the P4 one. It should be possible to make an O-ring fit around the outside of the IHS. Biggest problem here is pressure to make the O-ring seal. If I was to do it I would use RTV Silicone anyway which doesn't need as much pressure and it is an adhesive.... I will not be getting a A64/Opteron anytime soon though so that's about all I can add to that.