What I am concerned about here winewood is that adding an IHS to the die simulator IS going to increase the variance in the results. It IS going to be affected by the aging of the paste inside as it dries/settles. It will dramatically be changed by remounting the IHS. So in my opinion any testing with one is going to introduce more problems than it is worth. I see this honestly as the same argument that the uneducated use to advocate "real world testing" with CPUs.
And a 40mmx40mm TEC is a very different heat source than a CPU. A TEC truly will have the heat spread through the entire surface while the IHS will not. I still doubt that the lateral heat transfer is all that great. If the IHS could truly efficiently spread heat across its total surface then one wouldn't gain such big temp drops by pulling it off.
I mentioned these points already.
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