0.1 mm TIM, isn't that rather generous?
I like the way that this is progressing.
If I can suggest, let's seperate the issues into their individual components:
1-What is the size of the die, under the IHS? (AMD, Intel)
2-What is the nature and properties of the TIM joint under the IHS (AMD, Intel)? What are the dimensions of the IHS?
2-Given the above info, how far out does an IHS spread the heat (AMD Intel)? (that should give us our ideal heat die size)
3-What is the temperature difference that can be expected, by removing the IHS, as reported by the on die diode (AMD/Intel)?
If we knew the nature and properties of the TIM joint under the IHS, we could add a "correcting factor", for those people that are going to do away with the IHS (which, BTW, is not going to be common).
I haven't been succesfull yet, in confirming the AMD core sizes. Seems like AMD only releases info about the fully assembled package, so it doesn't include dimensions of the die, the IHS, nor the TIM joint. I still have to go over the Intel website, for the same info (I'm not looking forward to that one!)
I know the manufacturer of the Intel TIM material, between the die and the substrate: I'll have to see if Intel used the same manufacturer for the die-to-IHS joint.