Quote:
Originally posted by pHaestus
Now Les in your opinion would a thin heat spreader like the P4 be able to effectively spread the heat out over the entire heatspreader, or would there still be a fairly large "hot spot" over the die?
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That is the question.
Bill has given has given the practical answer.
My previous post was one of my several attempts to gain insight into it.
It depends on the how one identifies "spreading of heat".There will always be a "hot-spot" but to analyse the temp profile I guess a refined CFD programme is required - much beyond my self taught heat-tranfer expertise.
In referring to a P4 (or AMD for that matter) rather than a "Heat-Die" the issue is further complicated by the "Hot spot(s)" within the Die. Have only briefly looked at this problem :-
1)Gathered useful thoughts speaking to Navin (Artic Silver).He directed me to the idea that in AMD Morgan's the Temp differential between the "Hot_Spot" and the "Measuring Diode" may be equal to the differential between the "Measuring Diode" and the back side of the CPU. As such It may be possible to analyse data to produce a "Hot-Spot" Temperatures - so far my feeble attempts have been futile.
2) I considered small(1mm Sq) Heat-sources in some analysises of Mini-Channel coolers
http://forums.procooling.com/vbb/sho...?threadid=4477 . This was Pooh-Poohed as being irrelevant and has not pursued.