Joemac since you are an electical engineer with a lot of experience in testing I am sure you can recognize that the tests you want to see are not at all practical. If such is what you believe is the proper way to test, then an investment of time, money, and effort into computational analysis (such as done in that flotherm article) would be more useful than drilling holes into a waterblock.
Again if you take Bill's statement as true then lateral spreading is minimal. That would mean my approximation of a small die as heat source is still much closer to reality than your TEC. And what of just sticking a heatspreader onto the die? Other than the reproducibility issues discussed already, there is the issue of exactly HOW Intel and AMD do this. I suspect there must be something fancy involved in the case of Intel or else Bill wouldn't have an NDA. Don't get one of those for "we just slap it on". And so you are just trading one simplification (ignore the IHS) for another one (put one on in a manner not consistent with the chips). Such is life.
|