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winewood · 10-07-2003, 02:50 PM

Or.. just for arguments sake. Make ONE replicated die that simulates one of the new chips incorporating an IHS. This way you can say, I have replicated the heat from the AMD standard as close as possible. No one bench can replicate all standards, just attempt a single one with as much accuracy as possible. Not doing so would be acceptable if a major player wasn't putting the IHS on. However, since the IHS size is so large, and I see that there may be an issue with heated airpockets around the core that could come into play the longer a chip is powered... just a thought. I don't think these areas will stay room temperature.. in fact I wonder if they could reach 10C+ over amb.

10-07-2003, 02:50 PM	#47
winewood Cooling Savant Join Date: Nov 2002 Location: in my chair Posts: 574	Or.. just for arguments sake. Make ONE replicated die that simulates one of the new chips incorporating an IHS. This way you can say, I have replicated the heat from the AMD standard as close as possible. No one bench can replicate all standards, just attempt a single one with as much accuracy as possible. Not doing so would be acceptable if a major player wasn't putting the IHS on. However, since the IHS size is so large, and I see that there may be an issue with heated airpockets around the core that could come into play the longer a chip is powered... just a thought. I don't think these areas will stay room temperature.. in fact I wonder if they could reach 10C+ over amb. __________________ -winewood- Last edited by winewood; 10-07-2003 at 02:57 PM.