Quote:
Originally posted by winewood
Cathar, would you be willing to stop by the die sim discussion and help these guys find a way to integrate an IHS?
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Hmmm, an IHS should be a separate piece of material that sits on top of the die, and introduces its own thermal interface specifics. Machining it out of a single piece of copper with the die physically "attached" means that there is no thermal disjunction between the die and the IHS. This may not be what you want as it's a different scenario to the way IHS's are, which are simply bits of metal stuck atop a die with some thermal goop in between.
Of course, this then introduces an extra variable, that being ensuring that the thermal interface layer between the IHS and the CPU is consistent between multiple test instances. The thickness of the IHS is another variable. The thicker the IHS, the greater the lateral spread of heat through the IHS in terms of the contact patch between the cooling device and the IHS. One would need to ensure that the thickness of the IHS was matched with either a P4 and an AMD64 IHS, or there may be a fairly happy middle ground if their IHS's are fairly close in thickness.
No real easy answer here. IHS simulation is almost another form of art over and above getting the die simular setup properly. Yes, it'd be nice if the WTBA could do it, but I think getting the die simulator set up properly first, and then introducing an IHS piece later is perhaps the correct way to do it.