I have heard about many OCers using cold plates in conjunction with their TEC setups.
Will a cold plate work that much better than simply squishing the TEC between the CPU core and a waterblock?
(granted it works better if the size of the TEC and CPU core are almost identical)
On the smae note, what about a TEC directly on top of the NorthBridge chipset of a MB with a water block on top of that?
I know that the more pressure you use between the chip/plate and the TEC = better results. Just wondering if it is possible to avoid the cold plate on one setup (TEC chipset cooling) than another (TEC CPU cooling).
What has been your experience...
(I also know about protecting setup from condensation as well
