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HeaThru is a revolutionary diamond/copper composite with extremely high thermal conductivity and semiconductor-compatible thermal expansion properties for use within the IC thermal management industry.
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I havn't seen a composite of diamond and copper before. Heard plenty of yapping about plating and a solid diamond, but nothing like this.
They claim:
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currently up to over 3 mm in thickness, 50 mm diameter wafers with 90 mm diameter wafers available in the near future.
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Which is not good for water blocks nore heat sinks. 3mm thick is useless for CPU heatsinks and near usless for water blocks. I don;t see anything saying it can be milled easily? And what is the "real" cost of it? Surely not cheap...
Also:
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Metallization; HeaThru can be metallized for direct bonding with heat pipes, heat sinks or even the chip die
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Maybe AMD and Intel could use this for a heat spreader!
