Quote:
Originally posted by jaydee116
I will do mine up in Solid Works 2003 when I get around to it.
Anyway I will show the deminsions of the Chipset to be cooled. The block needs to be designed around that. It doesn't look as if the design you have there was done that way. The channel doesn't cover nearly enough of the area it should.
The VIA NB I am working off of is about 1 1/8" x 1 1/8". Figure about 15% past that area for heat spread and thats what needs to be cooled. It isn't like a CPU where it has a small die in the middle which your design would do better at being all the turbulance is in the middle. More on that later. I got to get back to work. 
|
Frankly, I don’t believe that the whole NB area disipates the same amount of heat....considering the good copper heat conductivity characteristics, the channel I've provided should be more than enough...