Quote:
Originally posted by jaydee116
heat is spread out over the GPU and NB. If it wasn't then there would be no reason to make the chipset as big as it is. Every section of the chip has parts underneath it and they all make heat.
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Might be a bit late to influence design, but: The chip is the size it is to acomadate the pins that fix it to the mobo. Every chipset I've lapped (GPU's & NB's) have been about 10mm x 12mm in the centre of the plastic(usualy, or Cu~GPU) 'chip'. You can see a depression from the
actual chip in the plastic(or Cu on GF/Ti's!!) when lapping. That is where the heat is produced. It looks like a CPU package with the chip in the middle and the pins around it, but not under it...
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I'd do something like this. The central part would be continous fins(not three rows) and would be 'more suitably proportioned'
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Edited for 'CODE' only twelve times! new low record!!...