Quote:
Originally posted by Starman97
The real problem here is going to be..
How do you get almost 200Amps
into the part without melting some pins or trace.
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That's why the majority of pins on CPUs are power & ground. And, that's why Intel is abandoning sockets for Land Grid Arrays. No pin resistance, no socket resistance, fewer solder joints, just matching contact pads on motherboard and chip carrier.
After that, live heatsinks? Signal lines at the bottom of the chip carrier; on the top, power and ground. The voltage regulator built into and cooled by the heatsink.
Fun stuff to contemplate.