Morning, it's bloody early(4.15am)
Been glancing thro whilst had coffee.
Not exactly sure which cross-checks.
However do confirm that the Cu shows K~390W/m*k (reassuring but not surprising since you fed in 392)
Assume you only want rough checks?
Confirm a "nearest CPU" (C/W)TIM =0.06203c/w (assuming 1mm offset)
Possibly a tad lower than the " 'til we know better" ~0.09 for a 1.1sq cm
But (1) Bill's value of 0.1(1sq cm) only allowed for an offset in the die t/c.There probably should,in my opinion, be an off set allowance for the wb's t/c; somewhere between 0.002 and 0.05(numbers are from memory but 0.002 is correct).This the point where simple analysis floundered.(2)Possibly accounted for by higher clamping pressure.(3) Forgetting(silly me) possibly the most important factor - the CPU Diode temp is effected by secondary mb cooling(added after more coffee)
Again for WB +TIM get similar 0.16643c/w ( 1mm t/c offset)
Have no comment on this value.
Earlier sums for Heat Flux seem correct(or at least the only example I checked) so, like you, I have to believe the numbers until it is found we are being stupid.
.
I do find the 1st graph inordinately pretty.
Not sure if these are the kind of checks you want, but I only do simple sums.Let me know
EDIT : Added : (3) Forgetting(silly me) possibly the most important factor - the CPU Diode temp is effected by secondary mb cooling(added after more coffee)
Last edited by Les; 12-10-2003 at 10:55 PM.
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