Direct Die Jet-Impingement?

101 · 11-08-2003, 10:58 PM

Has anyone taken the ides Cathar helped pioneer in the cascade to a direct die application? Basically using some sort of spray nozzle array to hit the bare die, as in a P4 with the IHS removed? I know that the cup geometry was calculated for the given nozzle array, water velocity, etc, etc.. but could the same techniques be applied to a P4 direct die configuration? Has anyone played around with this?

Cathar · 11-08-2003, 11:36 PM

Volenti is your man.

His work, which predates the Cascade, was part of the inspiration for the Cascade design.

101 · 11-09-2003, 12:09 AM

Thanks man, reading through the search results now. I figured some IHS free stuff was on your plate since I know you like to run your P4s naked as well. Seems like a logical step in any case.

JFettig · 11-09-2003, 08:52 AM

Also, with dirrectdie you are risking A LOT. mostly the life of the cpu wich doesnt usually last too long. they arent made for direct exposure to water. You would be better off direct IHS cooling or something. or even using a regular waterblock. I know this from experience. I had a dead cpu, and higher temps.

Jon

jaydee · 11-09-2003, 10:13 AM

How quickly I am forgotten.

---
Jets inside containment area.

--
The middle peice with jets lasered in and then milled around to fit inside the containment peice.

--
Containment peice with sloped side to direct the water out of the containment area and to the outlet.

101 · 11-09-2003, 02:33 PM

jaydee how did you seal that to the chip packaging? Also it looks like the caps and bridges are being exposed to the cooling fluid.

jaydee · 11-09-2003, 03:35 PM

Quote:

Originally posted by 101
jaydee how did you seal that to the chip packaging? Also it looks like the caps and bridges are being exposed to the cooling fluid.

Installed with water running through it:

Clear RTV silicon for sealant. Nothing is exposed (exept the die of course). Ran if for a couple days and turned out to be a waste of time. Best I got was 1C cooler than the Maze 4 and it got worst the hotter you ran the CPU. The die is just to small with to much heat concentrated. It needs some kind of heat spreader first. Namely a water block.

http://forums.procooling.com/vbb/sho...&threadid=7698

11-08-2003, 10:58 PM	#1
101 Cooling Neophyte Join Date: Feb 2002 Posts: 5	Direct Die Jet-Impingement? Has anyone taken the ides Cathar helped pioneer in the cascade to a direct die application? Basically using some sort of spray nozzle array to hit the bare die, as in a P4 with the IHS removed? I know that the cup geometry was calculated for the given nozzle array, water velocity, etc, etc.. but could the same techniques be applied to a P4 direct die configuration? Has anyone played around with this?

11-08-2003, 11:36 PM	#2
Cathar Thermophile Join Date: Sep 2002 Location: Melbourne, Australia Posts: 2,538	Volenti is your man. His work, which predates the Cascade, was part of the inspiration for the Cascade design.

11-09-2003, 12:09 AM	#3
101 Cooling Neophyte Join Date: Feb 2002 Posts: 5	Thanks man, reading through the search results now. I figured some IHS free stuff was on your plate since I know you like to run your P4s naked as well. Seems like a logical step in any case.

11-09-2003, 08:52 AM	#4
JFettig Cooling Savant Join Date: Feb 2003 Location: Willmar MN/Fargo ND Posts: 504	Also, with dirrectdie you are risking A LOT. mostly the life of the cpu wich doesnt usually last too long. they arent made for direct exposure to water. You would be better off direct IHS cooling or something. or even using a regular waterblock. I know this from experience. I had a dead cpu, and higher temps. Jon

11-09-2003, 10:13 AM	#5
jaydee Put up or Shut Up Join Date: Dec 2001 Location: Spokane WA Posts: 6,506	How quickly I am forgotten. --- Jets inside containment area. -- The middle peice with jets lasered in and then milled around to fit inside the containment peice. -- Containment peice with sloped side to direct the water out of the containment area and to the outlet.

11-09-2003, 02:33 PM	#6
101 Cooling Neophyte Join Date: Feb 2002 Posts: 5	jaydee how did you seal that to the chip packaging? Also it looks like the caps and bridges are being exposed to the cooling fluid.

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