![]() | ||
|
|
Testing and Benchmarking Discuss, design, and debate ways to evaluate the performace of he goods out there. |
![]() |
Thread Tools |
![]() |
#1 |
Responsible for 2%
of all the posts here. Join Date: May 2002
Location: Texas, U.S.A.
Posts: 8,302
|
![]()
Here we discuss Mounting Considerations, which may include, among other things, details of the very challenging TIM joint.
|
![]() |
![]() |
![]() |
#2 |
Put up or Shut Up
Join Date: Dec 2001
Location: Spokane WA
Posts: 6,506
|
![]()
How about mounting pressure and tim joint application. Depending on how anal you want to be maybe all the testers should use something more consistant then a paste. Also mounting pressure can have a significant effect on your C/W value as you can gain or loose a 1C with just a few pounds of pressure. Or am I wrong?
|
![]() |
![]() |
![]() |
#3 |
Cooling Savant
Join Date: Apr 2003
Location: Madison, WI
Posts: 225
|
![]()
your definately right; there are a lot of things to consider; the lapping of the waterblock, what thermal paste should be used for repeatability (will AS3's setting affect results?) and mounting pressure flat on the die.
Any of these can drastically affect temps. |
![]() |
![]() |
![]() |
#4 | |
c00ling p00n
Join Date: Jun 2002
Location: L.A.
Posts: 758
|
![]() Quote:
__________________
*:-.,_,.-:*'``'*:-.,_,.-:*'``'*:-.,_,.-:*'``'*:-.,_,.-:*'``'*:-.,_,.-:* E6700 @ 3.65Ghz / P5W DH Deluxe / 2GB 667 TeamGroup / 1900XTX PC Power & Cooling Turbo 510 Deluxe Mountain Mods U2-UFO Cube Storm G5 --> MP-01 --> PA 120.3 --> 2x DDC Ultras in Series --> Custom Clear Res "Artificial intelligence is no match for natural stupidity." 1,223,460+ Ghz Folding@Home aNonForums *:-.,_,.-:*'``'*:-.,_,.-:*'``'*:-.,_,.-:*'``'*:-.,_,.-:*'``'*:-.,_,.-:* |
|
![]() |
![]() |
![]() |
#5 |
Cooling Savant
Join Date: May 2003
Location: NY
Posts: 234
|
![]()
Can anyone recomend a place to get springs? My local sears has plenty but they are all to large and or they are the ones that are already compacted, IE designed for pulling not pushing.
|
![]() |
![]() |
![]() |
#6 |
Cooling Savant
Join Date: Dec 2002
Location: Dallas
Posts: 339
|
![]()
Can’t we just use a torque wrench to match an agreed pressure? E.g 16 psi
![]()
__________________
www.aquajoe.com |
![]() |
![]() |
![]() |
#7 |
Responsible for 2%
of all the posts here. Join Date: May 2002
Location: Texas, U.S.A.
Posts: 8,302
|
![]()
MsMaster ( www.mcmaster.com ) has some good info for springs, and is an excellent source.
How reproducible would a torque wrench be?:shrug: |
![]() |
![]() |
![]() |
#8 | |
Cooling Savant
Join Date: Dec 2002
Location: Dallas
Posts: 339
|
![]() Quote:
__________________
www.aquajoe.com |
|
![]() |
![]() |
![]() |
#9 |
Cooling Savant
Join Date: Mar 2003
Location: MO
Posts: 781
|
![]()
Torque wrench won't give you a pressure/PSI reading. Strangely enough, torque wrenches are for torque, measured in foot-pounds or newton-cm or whatever. To determine a thrust (pounds, not PSI) you'd need to know stud radius, thread pitch, and friction (both static and dynamic). Accuracy will suck and isn't worth the effort.
A better method would to be directly measure the springs. Load the spring with X pounds of compression and measure the resultant length with a micrometer. When mounting a block, compress the spring to that predetermined length. |
![]() |
![]() |
![]() |
#10 |
Cooling Savant
Join Date: Jun 2003
Location: North Billerica, MA, USA
Posts: 451
|
![]()
An off the wall thought I've had that might make the pressure / mounting / TIM question less of an issue would be to change the design of the CPU die and fixture. This might also be a good way to cut down on secondary path losses.
As I understand it, all the current simulators attempt to more or less reproduce a CPU sitting in a socket, and mount the WB like it was sitting on a real CPU and socket. This is good for 'looking like the real world' but seems to make life much more complicated. Instead, what would happen if one made the simulator so that it consisted of a hollow outer shell that more or less matched the outer dimensions of a CPU and socket on the outside, and the dimensions of the heater die on the inside. This shell would be made out of a rigid material with good thermal insulation properties (Phenolic?) It's outside surface would be designed to provide mounting for a variety of WB designs. The WB would be solidly clamped across the face of the shell, using enough pressure to ensure that it will NOT move. The heater die would then be slipped into the center of the shell and pushed against the WB's face by pressure applied from behind it. Advantages: 1. The shell provides a constant position for the WB face, and since it basically is sealing around the heat die, would insulate against secondary losses. 2. Because the surface the die is pushing against is always in the same relationship to the die, repeatable pressure should be easy to accomplish 3. Because the die and the shell are seperate parts, it should be possible to accomodate new form factors for processors or mounting types just by changing the shell, and not having to replace the more difficult to make and expensive heat die. 4. Concerns about torque loads etc. produced by plumbing connections are minimized. 5. Simpler mounting, could be made to work with multiple sizes / types of mounting hardware. Disadvantages: 1. Slightly less match to 'real world' 2. Might have difficulty with blocks the same size or smaller than the heat die (I believe these are quite rare however) I think #2 is rare enough to not be a problem, and the advantages in consistency and repeatability are enough to justify ignoring #1 Gooserider
__________________
Designing system, will have Tyan S2468UGN Dual Athlon MOBO, SCSI HDDS, other goodies. Will run LINUX only. Want to have silent running, minimal fans, and water cooled. Probably not OC'c |
![]() |
![]() |
![]() |
#11 |
Responsible for 2%
of all the posts here. Join Date: May 2002
Location: Texas, U.S.A.
Posts: 8,302
|
![]()
I had to print that to read it, and I still don't get it (sorry!). Can you clarify?
Have you seen the pictures of Bill's first heat die? It's a copper slug that includes a heater, and protrudes out of a phenolic resin wall, to simulate a CPU die. That's essentially the route that I'm going. There's nothing simple about it though: if I decide to use another die size, I have to replace the slug, which makes up the die, and includes the heater. Maybe a diagram of your idea would help? |
![]() |
![]() |
![]() |
#12 |
Cooling Neophyte
Join Date: Sep 2002
Location: MN
Posts: 23
|
![]()
Ben-
Seems to me that he is talking about instead of the inconsistancies of various mounting mechnisims for the block side mount the cooler/waterblock to a fixed static position and set the pressure for the die/heatslug to 'rise' to the block... Seems like it would equalize the mounting varibilities, but would create a large problem of making an insulated and movable heat die. |
![]() |
![]() |
![]() |
#13 | |||||||
Cooling Savant
Join Date: Jun 2003
Location: North Billerica, MA, USA
Posts: 451
|
![]() Quote:
Quote:
1. An outer sleeve that simulates the socket & CPU, and provides a mounting surface for the WB under test. It should be made of non thermally conductive material, and be insulated to the greatest extent feasible. The WB is mounted to this sleeve in a manner that is as rigid as possible, giving a constant location for the base's die contact area. 2. A heated 'die core' that fits snugly inside the sleeve, This would have the surface which contacts the WB, along with the heating and temp monitoring components. It would have a consistently repeatable mechanism for applying a constant pressure against the test WB's base (Possibly a cross bar holding one end of a spring, with the other pushing on the die core.) There would be no insulation on the core, but it would be necessary to insulate the back side of the hole that the core fits into. Quote:
Quote:
I'm suggesting a design that sacrifices some slight level of 'real world' duplication in an effort to get a more repeatable mount that would reduce or eliminate the need for multiple iterations of the same tests Quote:
Some of the earlier discussion seemed to be suggesting standardizing on the die size. If this is done, then it would work well with my proposal, as the die, which I see as the most critical part of the WB setup stays the same regardless of the sleeve that is used to match different form factor CPU's. [/quote] Maybe a diagram of your idea would help?[/quote] Difficult as I don't have an easy way to attach a drawing, but will try some ASCII art... Code:
~~~~~~~~~~~~~~~~~~~~ cut WBWBWBWBWBWBWBWBWBWB WB Base WBWBWBWBWBWBWBWBWBWB XXXX XXXX XXXXX SSSSSSSSSS XXXXX XXXX SSSSSSSSSS XXXX XXXXXX SSSSSSSSSS XXXXXX XXXXXX SSSSSSSSSS XXXXXX XXXXXX SSSSSSSSSS XXXXXX XXXXXX SSSSSSSSSS XXXXXX XXXXXX <<<<<< XXXXXX XXXXXX >>>>>> XXXXXX XXXXXX <<<<<< XXXXXX XXXBBBBBBBBBBBBBBBBBBXXX X = Sleeve material S = heated slug / die (pwr. and inst. wires not shown) <> = Spring B = crossbar for spring anchoring (Cross section drawing, not to scale) Quote:
Quote:
1. The top is the WB contact area, no insulation needed. 2. The sides would be insulated by the sleeve material. so the block itself doesn't need insulation. 3. The bottom would need some insulation, but it shouldn't be that hard to make an insulated cover for the bottom. I don't think it would matter that there was a small amount of airspace along the sides and bottom of the slug. It might take a few moments longer to reach equilibrium, but once the airspace temp reaches the same as the block, then you shouldn't have any further secondary losses other than what is allowed to filter past the sleeve insulation. Gooserider
__________________
Designing system, will have Tyan S2468UGN Dual Athlon MOBO, SCSI HDDS, other goodies. Will run LINUX only. Want to have silent running, minimal fans, and water cooled. Probably not OC'c |
|||||||
![]() |
![]() |
![]() |
#14 |
Responsible for 2%
of all the posts here. Join Date: May 2002
Location: Texas, U.S.A.
Posts: 8,302
|
![]()
You know, that's not a bad idea. Thanks for the clarification!
What I like about it is that it allows the slug to sit up against the block with a certain flexibility. What I don't like is that I was considering using a vacuum to insulate the slug, but I might be able to work with it. |
![]() |
![]() |
![]() |
#15 | |||
Cooling Savant
Join Date: Jun 2003
Location: North Billerica, MA, USA
Posts: 451
|
![]()
Hmm... wierdness - I replied a couple minutes ago, and it dissappeared - below is a recreation...
Quote:
Quote:
Quote:
However as designed I don't know how much help the vacuum would be. Since the sleeve and the slug would be in close contact, there would still be alot of thermal conduction losses. A minor redesign could probably handle much of this though. Obviously the sleeve would need to be made out of poor thermal conducting materials. Second get rid of most of the material touching the slug, leaving just enough to work as a guide. (Possibly a honeycomb pattern of some sort?) It should be possible to minimze the losses that way. Gooserider
__________________
Designing system, will have Tyan S2468UGN Dual Athlon MOBO, SCSI HDDS, other goodies. Will run LINUX only. Want to have silent running, minimal fans, and water cooled. Probably not OC'c |
|||
![]() |
![]() |
![]() |
#16 |
Responsible for 2%
of all the posts here. Join Date: May 2002
Location: Texas, U.S.A.
Posts: 8,302
|
![]()
Hmmm... maybe I could use an o-ring here... I'll have to give it some consideration.
|
![]() |
![]() |
![]() |
Currently Active Users Viewing This Thread: 1 (0 members and 1 guests) | |
Thread Tools | |
|
|