Improve the TIM joint?

[Groth]

What sort of mounting procedure do you envision? Use a small block, so that the socket lever can be moved? Solder a larger block to a CPU already in the socket?

[Since87]

Found a link discussing some of the issues.

Originally posted by Groth
What sort of mounting procedure do you envision? Use a small block, so that the socket lever can be moved? Solder a larger block to a CPU already in the socket?

Ahh, who wants to think about such boring practical issues.

[TallTxnMo]

Originally posted by jaydee116
I have mounted HS/blocks WITHOUT any thermal compound several times and never fried a CPU. And I assume you mean XP2400+ as T-Birds were phased out at 1400mhz.

Yes, I did mean the XP2400+. I've mounted more HS and WB than I can recall and never have fried a CPU before. But after investigating further, found that the problem maybe my Asus A7V333 M/B. Didn't findout until recently that there's all sorts of issues with this M/B.

[Al Kaseltzer]

Originally posted by redleader
http://www-esg.lbl.gov/esg/personnel...nsoldering.pdf

Take a look at the indium-bismuth solder. The eutatic point occurs at 78C for a ~79% indium solder. Meaning we could use it to solder a waterblock directly to the CPU die without cooking the CPU (which is typically rated to at least 90C). It also lists a few more exotic solders with even lower melting points.

The pdf mentions typical difficulties in soldering silicon, however it also proposes a solution. Add a thin metallic coating to the silicon die and then solder that.

How about eutectic indium-bismuth-tin with a melting point of 60 C ?

Did some searching around, found some data about Field's metal here. It's listed as alloy #19 (it's also in the PDF above) Doesn't include thermal conductivity for some reason, but I used the electrical conductivity to calculate a thermal conductivity of 14.4 W/mK. However, this calculation can be wildly innacurate, if anyone remembers the old copper-silver alloy myth that used to float around. It's the right order of magnitude compared to the other alloys listed.

As for the problem soldering to silicon, I think that's a non-issue. That's a problem with bonding to silicon, meaning the soldered joint has to sustain a load. We've got clips or bolts to do that. In fact, its an advantage because your HS/block will be removable without desoldering.

Field's metal appears to be the "low melting alloy" used in this TIM. Someone managed to get a sample and describes it [H]ere, although I'm pretty sure he's got the alloy contents wrong in his post. Thermagon gives the thermal conductivity as 18 W/mK, but I think that would be across the entire TIM, not just the Field's metal.

I Think the easiest way to mount it would be as a foil. like the Thermagon TIM except no extra layer of copper. Burn it in at 65 C and it solders itself. The main problem I see would be getting an consistent thickness in the foil if your home-brewing it.

[N8]

Hmmm. I have several different Indium alloys sitting at work. I can vapor plate a 1 micron thick layer of them onto just about anything. Might make a good experiment. Don't ask when I might get around to it though.:shrug:

[Les]

Think "ol' man" played with Indium alloys as a filler in pastes nearly 3 years ago
eg http://discussions.hardwarecentral.c...=thermal+paste.

Suspect it is also the basis of the filler in "Thermagic"
http://www.evertech.com/pages.cfm?ID=66
Previously discussed here :
http://forum.oc-forums.com/vb/showth...0&pagenumber=1

[Althornin]

New Thermal Paste

[mad mikee]

Time to wait and see - MikeE:shrug:

[romebaby]

Originally posted by bigben2k
Last I checked, there's a TIM between the Intel die, and the IHS, no?

I read this thread pretty quickly but I never saw it answered. Here's a guy who did it, with pics.

[Avaryan]

Originally posted by Althornin
New Thermal Paste

Bah, you beat me to it by a few hours. This stuff sounds pretty good, but we'll have to see how long it takes to get to market.

[bigben2k]

Welcome all the same, Avaryan!


Here's the mark to beat, for Arctic Silver 3 (from the site):

Thermal conductivity: >9.0 W/mK
layer 0.003" thick

The layer thickness is, of course, subjective.

In all the products I've seen, nothing comes close to this.:shrug:

[TallTxnMo]

What's ya'lls thought on the new Arctic Silver? I've only tried it on one processor and it fried immediately. Don't know if it was the paste or my motherboard though.

[bigben2k]

Ceramique is top notch.

Your experience certainly doesn't have anything to do with the product: it would have to be completely bogus to fry your CPU. Finger problems?

I got the Thermagon samples yesterdy, UPS. Now I have to figure out what they sent me...

[TallTxnMo]

Originally posted by bigben2k
Ceramique is top notch.

Your experience certainly doesn't have anything to do with the product: it would have to be completely bogus to fry your CPU. Finger problems?

I got the Thermagon samples yesterdy, UPS. Now I have to figure out what they sent me...

Ben,

Finally figured out it was my motherboard. A Asus A7v333. Known issue with earlier boards frying CPUs. My first and last Asus.

[Gulp35]

http://www.overclockers.com/articles792/index.asp

More on the new type of TIM posted above.