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Water Block Design / Construction Building your own block? Need info on designing one? Heres where to do it |
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#26 | |
Put up or Shut Up
Join Date: Dec 2001
Location: Spokane WA
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#27 | |
Cooling Savant
Join Date: Feb 2004
Location: Hertfordshire, England
Posts: 164
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#28 | |
Cooling Savant
Join Date: Feb 2004
Location: Hertfordshire, England
Posts: 164
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Similarly producing variations on the same theme based on the same old design is equally useless ![]() |
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#29 |
Cooling Savant
Join Date: Oct 2001
Location: Wigan UK
Posts: 929
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Cold-plate Spreading Resistance revisited.
1) Think* Bill is 90% right indicating h~2w/c.However this should be expressed as h~868w/m2*c for calculation purposes. The difference is mostly academic : ![]() Have included the Total Resistance of the Coldplate. This is obtained via: Coldplate Resistance(c/w)= Total Resistance(Waterloo) - Contact Resistance Contact Resistance= 1/(Area x h) , where h is expressed in w/m2*c. The effect on Die Temperatue : ![]() Kryotherm is used. Rc is the Coldplate Resistance + 0.0833c/w( TIM resistance for a 11x11mm layer) * Think I am wrong in equating h to the heatsink's Thermal Conductance(w/m2*c). The Film Coefficient(h) is the Thermal Conductance of the Coldplate's cold surface. This is taken as the [Reciprocal of the sum of Resistances] x Area. Resistance(to ambient)= PeltierC/W + Heatsink(C/W to ambient) +TIMs(C/W) Resistance(to ambient) is minimum when Heatsink(C/W to ambient)=0 and TIMs(C/W)=0. The Film Coefficient(h) is maximum when Resistance(to ambient) is minimum The Film Coefficient(h) will always be less than the inherent h~868w/m2*c Thermal Conductance of the Peltier. Kryotherm suggests that PeltierC/W ~ 0.5(actually 0.420) and hence the Maximum Film Coefficient(h) ~ 868w/m2*c (actually 1033w/m2*c) : ![]() Last edited by Les; 05-27-2004 at 03:37 PM. |
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#30 | |
Put up or Shut Up
Join Date: Dec 2001
Location: Spokane WA
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And where is all YOUR work posted on the subject? Where is your blocks, your plates, ect... Who are you to judge what is usless? Last edited by jaydee116; 05-27-2004 at 08:21 PM. |
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#31 | |
Cooling Savant
Join Date: Feb 2004
Location: Hertfordshire, England
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I am nobody d00de, take a chill pill, will ya? I wasn't making any personal remarks nor was I attacking anyone. THis is free public forum and freedom of speach is as far as I know one of the foundations of western life style ![]() If you feel offended by my general remarks I am sorry ![]() Maybe it is my general resources and costs conciousness that drives me through research first to production later. I personally would rather spend time designing things and fine tuning them as far as possible in virtual world and then, when theoretical means are exhausted, only start making working model. In this way I feel I am contributing my little bit towards saving energy and resources (not to mention I do not have time nor means to do countless prototypes as well as calcs take no time for me-theorycising deas take time mind you). Trial and error development methods are as valid as theoretical research and practiced by countless invemtors worldwide. Sorry again if I treaded on your toes, I did not mean to. P.s. Flatness of cold plates is one of the reasons why ther are not performning as well as they could ![]() Last edited by Jabo; 05-28-2004 at 08:38 AM. |
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#32 |
Cooling Savant
Join Date: Feb 2004
Location: Hertfordshire, England
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Les, your data is most interesting. I only wish the resolution was finer a bit.
The reason behind it is that it looks like the optimal thickness for all grpahs is the same. I know it is not but it looks like differences are extremely small and can be disregarded. It is very good news for costs of production since it'd mean 'one size fits all' ![]() I jus wonder how this relationship behaves for more powerful elements and more complex cold plate geometry? Are differences going to be equally minuscule? |
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#33 |
Thermophile
Join Date: May 2001
Location: UK
Posts: 1,064
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hmm, "d00de" is one of the most irritating "words" I've seen on the internet in quite a while.
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Once upon a time, in a land far far away... |
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#34 |
Cooling Neophyte
Join Date: Oct 2001
Location: maui, hawaii
Posts: 52
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what about HaX0r?
hehe.
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Cool with the best or burn like the rest. |
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#35 |
Cooling Neophyte
Join Date: May 2004
Location: Bundaberg
Posts: 19
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bloody hell i think i started a flame war...and no-one has answered my question!!!
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#36 | |
Cooling Savant
Join Date: Feb 2004
Location: Hertfordshire, England
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I'd rather drill than cut in 3mm since driling is more precise (I hope you got sth like a drill press at least) and will leave you nice flat border to fix your top to (may want to research derlin). I hope that at least I tried to answer your original quetion here ![]() P.S. Why not buy commercila block? |
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#37 | ||||
Put up or Shut Up
Join Date: Dec 2001
Location: Spokane WA
Posts: 6,506
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#39 | |
CoolingWorks Tech Guy Formerly "Unregistered"
Join Date: Dec 2000
Location: Posts: 2,371.493,106
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- an awful lot of blah blah here with no specifics 1) define flatness as it relates to cold plates 2) identify your source of data that reveals sub-potential performance 3) what 'should' the flatness be ? - and why ? 4) and what performance gains will result from using cold plates to your spec ? |
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#40 | |
Thermophile
Join Date: May 2001
Location: UK
Posts: 1,064
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__________________
Once upon a time, in a land far far away... |
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#41 | |
CoolingWorks Tech Guy Formerly "Unregistered"
Join Date: Dec 2000
Location: Posts: 2,371.493,106
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I guess Jabo's lofty self-esteem permits him such gratuitous dings Jabo, I'll give you a handle if you do not wish to use names when responding think KIA might fit ? |
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#42 |
Cooling Savant
Join Date: Feb 2004
Location: Hertfordshire, England
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I'll try to deflate my baloon a bit and aspire to keep my written English cleaner, just because I like you lot
![]() Forgive me being a tad thick but what KIA stands for? |
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#43 |
CoolingWorks Tech Guy Formerly "Unregistered"
Join Date: Dec 2000
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Jabo
you are not thick, suspect a language thing a name is far preferable to a label, shows a bit of courtesy you may skip KIA, too sarcastic by far; withdrawn - sorry -> and my questions above ? |
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#44 | |
Cooling Savant
Join Date: Feb 2004
Location: Hertfordshire, England
Posts: 164
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1.Contact surface between CPUs die and cold plate should be as flat as possible/feasible. 2.First amendment please ![]() 3. See point 1, reason as many molecules of each of materials are gonna be in cotact with ever flatter surfaces, flatness 'level' is gonna be governed by costs only. 4. One is quite certian, cold plate will be lighter ![]() Now, theoretically perfect water block of classical pin design resembles a hedgehog. Imagine swiffy's lates but base is a hlaf sphere with pins 'bit' curved. inlet at the top and outlet as a gutter on the perimeter (get a glass ball and run a stream of water down on it) Reason? Equal distance from each point on the thermal exchange surface from energy source resulting in perfect isotherms layout and superior surface are to any of the current designs. This is why Bill's new block performs so well compared to Cathars designs. Swiftech's block has much lower energy dissipation per mm^2 (jetted area) compared to Cathars design but makes iit up with MUCH larger surface on which such desnity is present making it extremely good low flow (read universal) design - overall winner. Trully elegant engineering solution, no fireworks but good solid conceptual work transpiring into extremely low production costs (pleae, do not read any brown nosing into this, it is sincere and I have no business saying one way or the other). Anyone want to attempt spherical block with 'gutter' return? |
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#45 | |
Cooling Savant
Join Date: Feb 2004
Location: Hertfordshire, England
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![]() and sometimes I too get carried away (I catch fire pretty easily) |
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#46 |
Cooling Neophyte
Join Date: May 2004
Location: Bundaberg
Posts: 19
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what would be the best way to have the water flowing through the system?
I was think of having the water go through the pump then through the heatercore and then onto the CPU waterblock. now at the water block i was planning on splitting the water path in two making one go to the mobo chipset and the other go to the graphics card. then they would both meet up again and go back to the pump is that ok for the flowpath? that was the question that i asked thanks for anyone who answers the question |
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#47 |
Cooling Savant
Join Date: Feb 2004
Location: Hertfordshire, England
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Go like this : rad->pump->CPU->gp->rad
Radiator does not benefit from high pressure nearly as much as water blocks and unless your pump dumps massive amounts of heat into water there's no point in placing rad between pump and CPU block - we want block to enjoy the highest pressure in the system |
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#48 | |
Cooling Savant
Join Date: Oct 2001
Location: Wigan UK
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It is a new concept to me. Think is crap but I am open to elucidation |
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#49 |
Cooling Savant
Join Date: Oct 2001
Location: Wigan UK
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[quote=Jabo]
I jus wonder how this relationship behaves for more powerful elements ...........?[quote] ![]() But the question is whether the method is right ? Then whether my implementation is correct. |
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#50 | |
Cooling Savant
Join Date: Sep 2003
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