The plan for my next week

[Les]

Originally Posted by Incoherent

Les.

Your h(eff) vs flow chart, specifically the MP-05-SP?..

For h(conv) used Flomerics
Eff Conv Area of 14.4x14.4(~2.1cm^2 obtained from specimen h(conv) vs r at 1GPM(Attached)

Attached half cleaned Excel extract
For f used Novel Concepts Slab Fin Efficiency Calculator

Edit1. Again, zip only opens when I use FlashGet to download
Have/will mail

Edit2: Did find TIM was Spreading when used a K and thickness.Now just add as R(TIM)
Added Waterloo solutions, Virgin Rwbs for uniform flux 10x10mm dies
You still using Golden Bananas as x-axis?

[Les]

Originally Posted by BillA

..
not too sure the furniture can be separated from the bp, I understand to what you are referring (I think, lol)
- better to determine h(eff) for the flat bp experimentally for thickness/area as req to validate the model, of course by flow 'regime'

The direction intended with my only wb construction(here and here) but was overtaken by the rush for "the best wb"

[Marci]

Few more poss handy links....

http://www.rntfoil.com/_assets/pdf/RNT-2004-IMAPS.pdf
http://www.aimsolder.com/troubleshoo...sSpecialty.pdf

[Les]

Originally Posted by Les

WWLE 17x15x 0.8 mainly but..

Use mostly h(eff) @ r=7.5mm (pick-and-mix, lowest Virgin Rwb wins)
The big "light orange"(officially) points on h(eff) profile graph.
The corresponding h(conv) and h(eff) vs bananas are shown

Edit: Also, in addition to WWLE, mislead you on h(eff) for MCW6000.
Here consistently used h(eff) for 40x40 PCA but it is lower than "Max h(eff)" shown.
Mailing you with correct h(eff)(40x40) and h(conv)(40x40).

[Incoherent]

Originally Posted by Marci

Few more poss handy links....

http://www.rntfoil.com/_assets/pdf/RNT-2004-IMAPS.pdf
http://www.aimsolder.com/troubleshoo...sSpecialty.pdf

Really interesting links Marci.

I wonder if it is feasible to use these AIM alloys instead of thermal compound, effectively soldering the waterblock to the CPU. The AIM 70 could be interesting, put a sliver of the foil between block and die and do a controlled heating, pump off or hot water in the loop for a few minutes.
Pretty neat. Wonder if it would bond to silicon properly...


I think we should move to another thread with the modelling. I'll start something when I have more to post.

[Marci]

Indigo is holding more curiosity for me at the moment...

http://www.enerdynesolutions.com/tech_indigo.html

[Les]

Originally Posted by Incoherent

..........I think we should move to another thread with the modelling. I'll start something when I have more to post.

Fine.
Will go to pub.
Think have earned a gallon of ale this week.
I pay myself 1gal(uk) of ale/100hr(£0.1176/hr)
Strangely, I find my quality of work is inversely proportional to renumeration

[BillA]

"Strangely, I find my quality of work is inversely proportional to renumeration"
nah, just an artifact of data collection
recal and you're good to go (don't get a ride with Marci though)

[Marci]

*woosh* /me looks up as that one whizzes straight over my head

We all have our vices / personal rewards... (in a sleepy voice from amidst a pillar of oddly scented smoke)

[Albigger]

I'm sure you guys have seen it, but more about metal interface materials

Article by Joe at Overclockers

[Les]

Originally Posted by Incoherent

...I think we should move to another thread with the modelling. I'll start something when I have more to post.

If moving out and up(hopefully), may I suggest we consider,at some point, the thermal conditions similar to those considered in Marci's link:
http://www.intel.com/technology/itj/...linterface.htm

My intention was to finish attachments to Post 58(said would add) for Far-Surface HotSpot with and without IHS and show illustration of effect of Side-Cooling on HotSpot("smoke and mirrors").
However have withdrawn attachment (error in sums), will post in the new thread at my leisure.

[Les]

Rewritten last Post.
Not now completing attachments to Post 58
Attachment deleted (errors in sums) and will post at my leisure in new thread.

Edit:
The root of the prob which caused withdrawing of my model AMD3000+ attachments:-
Get different solutions when considering "bp +IHS" as one entity and calculating separately .
e.g Apogee(34diam x3)+TIM(0.06c/w*cm^2) + IHS(34diamx1mm) on 11.34 diam Source.
At h(eff)=43788 and IsoFlux
Consider as continuous 4mm or continuous (3+1)mm then adding TIM get: R(water -> far IHS surface) = 0.112777+0.006607=0.11938
Considered as (3mm with h=h(eff)) + (1mm with h=1/(Rbp+1/h(eff)*A+Rtim)*A get: R(water -> far IHS surface) = 0.156659

[Joe]

is it next week yet?

[pHaestus]

eh just fire me

[Joe]

No this is much more fun