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General Liquid/Water Cooling Discussion For discussion about Full Cooling System kits, or general cooling topics. Keep specific cooling items like pumps, radiators, etc... in their specific forums. |
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#1 |
Cooling Neophyte
Join Date: Apr 2002
Posts: 8
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Just curious about this. I have a Maze3 waterblock and have been screwing around with different things. One thing I have been noticing when I remove the block is the center of the square of Arctic Silver compound that is left on the heatsink is very thin. There is a good amount around the square like it was squished out. It's almost like I screwed down too tight on the posts and all the compound leaked out of the middle. Can that happen?
It's never happened to me with my regular air cooled heatsinks without posts. |
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#2 |
Thermophile
Join Date: Oct 2001
Location: Nuu Zeeelin
Posts: 3,175
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thats fine, the tighter is the better, until you crush the core itself. The purpose of the AS3 is just to fill the gaps between the copper and the core
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2x P3 1100's at 1400, Abit VP6, 2x Corsair 256mb PC150 sticks, 20gb 'cuda ATA-III, 2x 40gb 'cuda ATA-IV in raid 0. 20" Trinitron. No fans 2x 2400+ at 2288mhz (16.0 x 143), Iwill MPX2, 2x Kingmax PC-3200 256mb sticks, 4x 20gb 60gxp in Raid 5 on a Promise SX6000. Asus Ti4200 320/630. Cooled by Water |
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#3 |
Cooling Savant
Join Date: Mar 2002
Location: Mississippi
Posts: 434
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sounds like ur puttin too much as3...read this http://www.arcticsilver.com/arctic_s...structions.htm and follow it....ull get the best results that way
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#4 |
Cooling Neophyte
Join Date: Aug 2001
Location: Danville
Posts: 96
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"ALL" the compound will never leak out.
The purpose of AS and other thermal compounds is not to provide a thick buffer between the cpu die and the heatsink, but rather provide the best thermal transfer with the least resistance, meaning apply only a THING layer. AS is built from the ground up to fill in those microscopic gaps which is what makes it perform so well. general rule of thumb: don't follow the american way/ideal in which excessiveness is best when dealing with a thermal interface.
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What a chump. |
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#5 |
Cooling Savant
Join Date: Nov 2000
Posts: 130
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remember guys, these cpus have peaks and valleys that aren't "microscopic". Sometimes you have to put more than a tiny amount on. Stylerod, try three different applications and see which one gives you the best results. Apply it real thin, a little thicker, and then a little thicker. Use your common sense as far as your final application. Once you have it nailed down as far as how much your particular cpu likes, go with it.
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ondaedg@procooling.com |
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#6 |
Cooling Neophyte
Join Date: Apr 2002
Posts: 8
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Actually my first application was very thin. When I took off the waterblock I could actually see the letters that were on the CPU die on the back of the waterblock. Thinking I maybe used too thin a layer I used a little but more, not a lot, I'm still talking about a rice sized glop then smoothed with a razor blade. I guess this is normal and I will go back to the smaller amount. Thanks guys.
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#7 | |
Cooling Savant
Join Date: Feb 2002
Location: Illinois
Posts: 389
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Too tight, BTW was my problem a couple of days ago, had to buy a new chip! The letters of the CPU are usually 'burned' into the bottom of my HS's. Jim |
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